Self-cleaning slurry arm on a CMP tool
US6506098B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2002 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | May 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A self-cleaning apparatus for use in a chemical mechanical polishing tool. The apparatus includes a slurry-dispensing arm with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. A slurry-dispensing nozzle is positioned under the first end for dispensing a polishing slurry against the polishing pad. The first end has a compound slanted top surface, a front face and adjoining side surfaces. The compound slanted top surface forms a longitudinal peak slanting from center to both sides and from the back end to the front face. The top surface of the first end has a liquid distribution manifold that is mounted distally from the front face and has a plurality of nozzles directed to spray deionized water to wash away slurry splatter from surfaces of the first end of the slurry dispensing arm during the water polishing cycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.