Radiation-sensitive resin composition
US6506537B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2001 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive-type radiation-sensitive resin composition is provided. The composition includes:(A) a low-molecular compound comprising a compound having at least one amino group having one or two hydrogen atom(s) bonded to the nitrogen atom; at least one hydrogen atom the amino group has having been substituted with a t-butoxycarbonyl group;(B) a radiation-sensitive acid generator; and(C) a silicon-atom-containing resin comprising an alkali-insoluble or alkali-slightly-soluble resin having been protected with an acid-cleavable group; the resin being capable of turning soluble in alkali upon cleavage of the acid-cleavable group.This radiation-sensitive resin composition is effectively responsive to radiations of various types, has superior sensitivity and resolution and also a superior long-term storage stability, and is useful as a positive-type chemically amplified resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.