Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
US6506620B1 · kind B1 · utility
26Cited by
19References
6Claims
0Family size
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Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0142
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.