Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
US6506664B1 · kind B1 · utility
115Cited by
5References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Apr 3, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Apr 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of: forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer; attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer; partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the camer, followed by coing the polymer adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.