Method and apparatus for laser processing
US6507003B2 · kind B2 · utility
5Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2001 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The laser processing apparatus includes lasers for emitting a plurality of laser beams of different wavelengths, a common phase grating for splitting the laser beams of different wavelengths into diffraction beams shaped in designed arrays, and a condenser lens for condensing the diffraction beams. The layout of the focused diffraction beam spots of each wavelength is decided in accordance with the design of the phase grating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.