Apparatus having an electronic component located on a surface of a package member with a space therebetween
US6507139B1 · kind B1 · utility
13Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Jun 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.