Integral fuse for use in semiconductor packages
US6507264B1 · kind B1 · utility
30Cited by
15References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Feb 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fuse element partially encapsulated in an arc-suppression material which can, in turn, be integrated along with a semiconductor device into a semiconductor package to provide overcurrent protection, as well as a method of integrating such a fuse along with a semiconductor device into a semiconductor package wherein the semiconductor package has a standard form factor based on the semiconductor device integrated within.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.