Chip type solid electrolytic capacitor
US6507482B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2001 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Nov 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a structure for mounting an electronic part, including (a) an electronic part in the form of a chip, (b) a resin block entirely covering the electronic part therewith, and (c) a pair of electrodes electrically connected to the electronic part and extending outwardly of the resin block, the electronic part being deviated in position in a direction relative to a center of the structure, the resin block being formed with a raised portion extending downwardly from a bottom surface of the resin block, the resin block having a tapered portion between a top surface of the raised portion and the bottom surface of the resin block in the direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.