Apparatus for positioning electronic components
US6507996B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 16, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Aug 16, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a device for positioning electronic circuits arranged on a foil (2), such as chips (1), on a circuit card (11), ceramic substrate or the like, using the flip-chip method. The chips (1) are lifted from the foil (2) by needles (4) located under said foil and are further picked up by a needle with a suction cup (3) or by a suction cup that rotates said chips (1) by 180°. The chips are then received by another needle with a suction cup (10) and positioned on the circuit card (11) for direct connection of the contact lines. The needles (4) used for lifting the chips (1) as well as the needle with the suction cup (3) for receiving said chips (1) are capable of synchronous and mainly rectilinear or vertical displacement. The needle with the suction cup (3) is placed in a us holder (5) which is mounted in an arm (6) so as to be capable of movement, wherein said arm is driven by a drive organ (9) in order to carry out the 180° rotation movement. The additional needle with the suction cup (10) is also arranged in a holder (12) that provides it with four degrees of freedom, i.e. along the axes x, y, z and rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.