Method of mounting fluid ejection device
US6508536B1 · kind B1 · utility
13Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Mar 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of mounting a fluid ejection device having a first plurality of pads on a carrier substrate having a corresponding second plurality of pads includes positioning the first plurality of pads with respect to the second plurality of pads, and melting solder between the first plurality of pads and the second plurality of pads. Melting the solder includes aligning the first plurality of pads with respect to the second plurality of pads with a solder reflow force and forming a fluidic boundary between the fluid ejection device and the carrier substrate with the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.