Multi-layer conductive device interconnection
US6508674B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Oct 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/36
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive network includes a first conductive device having multiple first signal layers. Each first signal layer has a first substrate and a plurality of first conductive traces disposed on one side of the first substrate. The network further includes a second conductive device having multiple second signal layers. Each second signal layer has a second substrate and a plurality of second conductive traces disposed on one side of the second substrate. In addition, the network includes at least one bridge layer for electrically joining together the first and second conductive devices. The at least one bridge layer has a bridge substrate and a plurality of bridge traces supported by the bridge substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.