Apparatus for depositing a material by evaporation on large surface substrates
US6509061B1 · kind B1 · utility
5Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1997 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Oct 21, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/505
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for depositing a material by evaporation on a substrate having a large surface. The apparatus includes an enclosure in which are placed a number of material evaporation sources. It also includes a device for channeling or piping of vapors emitted by the sources toward the substrate during evaporation. This is formed by walls or covers which define compartments within the enclosure, each evaporation source being placed in a compartment. The apparatus can also utilize a device for moving the substrate in order to improve the uniformity of the deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.