Moulding materials with a polyarylene ether sulfone and aliphatic polyamide base
US6509403B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2001 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Feb 26, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L81/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Molding compositions compriseA) at least one polyarylene ether sulfone,B) at least one aliphatic polyamide,C) at least one filler, and also if desiredD) an impact-modifying rubber or a mixture of various impact-modifying rubbers, andE) an additive or a mixture of various additives wherein the viscosity number of the polyamides B (measured in 0.5% strength by weight solution in 96% strength by weight sulfuric acid to DIN 53 727) is at least 180 ml/g, and the molding compositions compriseF) from 100 ppm to 0.5% by weight, based on the total weight of A to E, of copper bromide or copper iodide or a mixture of these.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.