Transducing head and method for forming a recessed shield for a transducing head
US6510030B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Mar 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a transducing head first requires the deposition of a bottom shield, a bottom thick gap, a bottom thin gap, a sensor, a first flux guide, a top thin gap, a top thick gap, and a top shield. After each of the layers is deposited, an air bearing portion of both the top and bottom thick gaps is removed, such that a length of the air bearing portion of the top thick gap is substantially equal to a length of the air bearing portion of the bottom thick gap. Next, an air bearing shield is deposited over the air bearing surface, the air bearing shield being in contact with the top and bottom shields, the top and bottom thick gaps, the top and bottom thin gaps, and the flux guide. Finally, the air bearing surface of the transducing head is planarized, resulting in the top and bottom thin gaps and the first flux guide each being exposed at the air bearing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.