Integrated chip optical devices
US6510258B1 · kind B1 · utility
1Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Mar 28, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4239
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of forming an integrated chip optical device as a protective layer formed over part of the face of the chip on which at least one optical waveguide is formed, and the protective coating is selectively removed leaving the coating over an edge region 18 and the edge of the device is polished to provide high edge quality against which offchip optical fibers may be abutted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.