Method for forming a dielectric laminated device
US6510607B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4916
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.