Method and apparatus using laminated foils for placing conductive preforms
US6510977B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 2, 2000 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Oct 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are disclosed for placing solder balls 320 on electronic pads 910 or 1010 on a component 900 or substrate 1000, such as for a ball grid array (BGA) applicator 100. The solder balls 320 are held to openings 202 in a foil 130 against a second layer 350 by a holding force, whereby the second layer is of a porous material and laminated to the foil 130. One such holding force can be a vacuum force 222 applied to the solder balls 320 through the openings 202 in a foil 130. After locating the solder balls 320 at electronic pads 910 or 1010 on a component 900 or substrate 1000, by removing the holding force 222, the solder balls 320 are released and placed on the electronic pads 910, 1010. Optionally, a plurality of pins may provide a releasing and/or placing force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.