Solder jet machine and soldering method
US6510978B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2000 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Oct 31, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
To provide a solder jet machine with which a molten solder wave with stable height can be obtained. A satisfactory and stable molten solder wave is obtained by forming wall portions surrounding solder ejecting ports, which are arranged in a first, a second and a third ejecting-port rows on a solder wave forming plate, in such a manner that they are allowed to project upwardly, in addition, by forming groove portions, which are for introducing the ejected solder in such a direction as to be allowed to flow down, around the above-described solder ejecting ports, so that the molten solder ejected from the solder ejecting ports in the third row and the second row can flow down rapidly between adjacent solder ejecting ports in the first row without disturbing any wave of the molten solder ejected from the first row.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.