Method of fabricating a matrix display system
US6511187B1 · kind B1 · utility
34Cited by
40References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1998 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Jun 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6713
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a display system includes bonding a silicon substrate to a second substrate with an insulating layer. The silicon substrate is thinned to form a thin film silicon-on-insulator (SOI) structure. A matrix display circuit is formed with the SOI structure. A light shield pattern is formed over regions of the matrix display circuit. A light source, the matrix display circuit and a magnifying lens are positioned within a display housing such that light from the light source is directed onto the display and an image on the display is magnified by the lens for viewing by a user.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.