Optoelectronic assembly and method for fabricating the same
US6511236B1 · kind B1 · utility
26Cited by
22References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1999 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Sep 7, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate having a positioning floor, a platform and an optional ring frame of precisely determined height. Optical components picked and placed on a substrate floor, a raised platform and frame. A flexure assembly allows fine positioning of components requiring critical optical alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.