Lapping machine
US6511365B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1999 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Dec 10, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a lapping machine in which abrasive grains can be efficiently and completely removed from a lapping plate. In the lapping machine of the present invention, a lapping plate has a lapping face and rotates about a rotary shaft. A moving member has a wiping face extended in a longitudinal and moves, in a plane parallel to the lapping face of the lapping plate, in the direction perpendicular to the wiping face. A driving mechanism moves the moving member. With this structure, the moving member securely catches and removes foreign substances from the lapping plate. The foreign substances left can be completely removed in a short time and the working efficiency of the lapping steps can be highly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.