IC-compatible parylene MEMS technology and its application in integrated sensors
US6511859B1 · kind B1 · utility
9Cited by
10References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 10, 2000 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Mar 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A combined IC/Mems process forms the IC parts first, and then forms the MEMS parts. One option forms a parylene overlayer, then forms a cavity under the parylene overlayer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.