Wiring circuit board and method for producing same
US6512182B2 · kind B2 · utility
76Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2002 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Mar 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.