Semiconductor pressure sensor device having sensor chip covered with protective member
US6512255B2 · kind B2 · utility
41Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2001 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Jul 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device has a semiconductor sensor chip mounted on a resin package with which insert pins are insert-molded. The sensor chip and the pins are electrically connected to each other by bonding wires. An electrically insulating protective member covers the chip, the pins, and the wires. The protective member has a saturated swelling coefficient of approximately 7 wt % at most when the protective member is immersed into gasoline having a temperature of 20° C. Accordingly, bubbles are prevented from being produced in the protective member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.