Method of producing plural device chips from a thin plate of a pyroelectric material
US6513214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Jul 21, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
Abstract
A method of producing plural device chips from a thin plate of a pyroelectric material comprises the following steps. First, plural device-forming regions each having an electrode and a circuit pattern for electrically connecting the electrodes are formed on each of front and rear surfaces of the thin plate to obtain a device substrate. By making an electrical connection between the circuit patterns, and grounding it, all of the device-forming regions on the device substrate are at the same potential. Next, a blast treatment is performed to the device substrate to remove a required region of the pyroelectric material, while leaving a bridge portion extending between adjacent device-forming regions and having the circuit patterns thereon, so that a device-chip aggregate is formed, in which adjacent device chips are coupled through the bridge portion. Subsequently, by removing the bridge portion, the device chip is separated from the device-chip aggregate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.