Method for mounting a microcircuit in a cavity of a card forming a support and resulting card
US6513718B1 · kind B1 · utility
14Cited by
19References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2000 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48228
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
To mount a microcircuit module in a cavity in a card forming a support, resin is deposited on the bottom of the cavity and the module is fitted in such a way that the microcircuit is coated with resin. A compressible annular area formed in the cavity completely surrounds the microcircuit and the coating material. The annular area extends over a continuous peripheral area of the bottom of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.