Test and burn-in socket clamping mechanism
US6514097B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 1, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Aug 1, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0466
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test and burn-in socket assembly designed to hold an integrated circuit module during testing or burn-in has a base that mounts a printed circuit connection board. The base has a central opening in which the integrated circuit module can be inserted. A pair of locking arms that will engage and clamp the integrated circuit module onto the printed circuit board are supported on a movable frame that is movable toward and away from the base. The arms are moved between clamping and release positions as the movable frame is moved. The movable frame is actuate by cams that are simultaneously moved by a handle or bail. The clamping arms are controlled so that they will move perpendicular to the integrated circuit when they are close to the board and move laterally to provide a space for installing and removing a board from its installed position. The board that has been tested to be removed and a new board to be inserted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.