Apparatus and method for purging injection molding system
US6514440B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2000 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Sep 7, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76906
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding apparatus, system and method are provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method of open-mold purging is provided in an injection molding system including a manifold to receive material injected from an injection molding machine. The method includes the steps of selecting a target purge pressure; injecting material from the injection molding machine into the manifold; and controlling the purge pressure to substantially track the target purge pressure, wherein the purge pressure is controllable independently from the injection molding machine pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.