Built-in inspection template for a printed circuit
US6514777B2 · kind B2 · utility
1Cited by
14References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Apr 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.