Method for handling a plurality of circuit chips

US6514790B1 · kind B1 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Andreas Plettner · Feldafing, DE
• Karl Haberger · Planegg, DE
• Christof Landesberger · Gräfelfing, DE

Key dates

• Filing date: May 29, 2001
• Grant date: Feb 4, 2003
• Expiry date: May 29, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67132
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, the plurality of circuit chips is picked up by a plurality of pick up devices. The plurality of pick up devices with the picked up circuit chips is moved simultaneously to one or several carriers, in such a way that, simultaneously with the motion, the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement. Then the circuit chips are simultaneously placed in the second arrangement on the one or several carriers.