Composition of epoxy resin and triazine-formaldehyde-phenol resin
US6515047B2 · kind B2 · utility
2Cited by
2References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 15, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Mar 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing:(A) an epoxy resin and(B) a phenol resinrepresented by the following general formula (1): wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.