Printed circuit board arrangement
US6515222B2 · kind B2 · utility
14Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Feb 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal(27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.