Through-hole wiring board
US6515237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Nov 21, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper toil lands and copper foil circuits formed on surfaces of the substrate; insulating layers formed on the copper toil circuits and between necessary portions of the copper foil lands and the copper foil circuits; and printed circuits (jumper circuits) formed by another electroconductive material having a different composition from that filling the through-holes on a part of the copper foil circuits, and the copper foil lands and the insulating layers except for unnecessary portions for electroconductivity; wherein the printed circuits and ends of the through-holes are electrically connected with an electroconductive material having a different composition from that filling the through-holes, permits easy formation of an electrical connection of the through-holes, has a high reliability on connection and is suitable for industrial production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.