Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same
US6515324B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Aug 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A capacitor has a lower electrode, a dielectric thin film, an upper electrode, and an insulation cover layer formed on an insulation substrate made of an organic film or a ceramic material, and through holes formed at positions corresponding to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package, with electrodes for connection to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package provided within through holes. In a method for mounting the capacitor, the capacitor is interposed between a flip-chip connected semiconductor element and a mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.