Functionality change by bond optioning decoding
US6515505B1 · kind B1 · utility
49Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 29, 1997 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Jul 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for functionality change in an integrated circuit chip includes bonding pads by which the functionality of the chip may be selected. Bonding pads are connected to a decoder which determines which path of a predetermined number of paths is to be chosen to provide the selected function. Control signals are fed to logic circuits in predetermined portions of the remainder of the integrated circuit chip to control functions of sub-circuits within the various portions of the integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.