Thermal distribution system
US6515858B2 · kind B2 · utility
38Cited by
13References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Jun 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to high density electronic power supplies and more particularly switching power supplies employing a metallic enclosure and integral cooling means. The configuration employs an array of thermally conductive metal bars to optimally distribute heat from a number of dissipative elements to a thermally conductive metal element that has substantial surface area within an internally generated air stream. The thermally conductive metal element may be the metal enclosure that also acts as a heat sink or fins, both of which provide substantial surface area to the air stream.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.