Heat transfer element assembly
US6516871B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1999 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Aug 18, 2019 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D19/044
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The thermal performance of the heat transfer element assemblies for rotary regenerative air preheaters is enhanced to provide a desired level of heat transfer and pressure drop with a reduced weight. The heat transfer plates in the assemblies have spaced apart dimples for maintaining plate spacing and oblique undulations with the undulations on adjacent plates preferably extending at opposite oblique angles. The dimples may be on every other plate and alternate between the two sides of the plates or they may be on every plate and all extend to the same side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.