High speed pressure mount connector
US6517360B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jun 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6587
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high speed, high density electrical connector for use with printed circuit boards is described. The connector is manufactured with wafer assemblies that are supported by a stiffener. Each wafer includes two pieces; a first piece supports both signal and ground conductors and a second piece supports signal conductors. The disclosed embodiments are principally configured for carrying differential signals, though other configurations are discussed. For differential signals, the signal conductors are arranged in pairs. The two pieces are attached together such that the signal pairs are formed with the broadside of, the conductors disposed adjacent. The connector attaches to at least one circuit board using pressure mounted contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.