Method of manufacture of printed wiring boards having multi-purpose finish
US6517893B2 · kind B2 · utility
11Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Aug 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.