Methods of treating preform elements
US6517902B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jun 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of thermally treating a preform element, of the kind having a facing table of polycrystalline diamond bonded to a substrate of cemented tungsten carbide, comprises the steps of: (a) heating the element to a soaking temperature of 550-625° C., and preferably about 600° C., (b) maintaining the element at that temperature for at least one hour, and (c) cooling the element to ambient temperature. The resulting preform element has a substrate with a cobalt binder including a substrate interface zone with at least 30 percent by volume of the cobalt binder a hexagonal close packed crystal structure. This reduces the risk of cracking or delamination of the element in use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.