Lithographic template and method of formation and use
US6517977B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jul 10, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/025
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (20, 30, 42) is formed having a substrate (22, 32) and a template pedestal (24, 34) having formed thereon an uppermost surface an etched pattern or relief image (26, 36, 48). The template (20, 30, 42) is used in the fabrication of a semiconductor device (44) for affecting a pattern in the device (44) by positioning the template (20, 30, 42) in close proximity to semiconductor device (44) having a radiation sensitive material (50) formed thereon and applying a pressure (52) to cause the radiation sensitive material (50) to flow into the relief image (48) present on the template (42). Radiation (53) is then applied through the template (42) so as to further cure portions of the radiation sensitive material (50) and further define the pattern in the radiation sensitive material (50). The template (20, 30, 42) is then removed to complete fabrication of semiconductor device (…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.