N-sulfonyloxyimide compound and radiation-sensitive resin composition using the same
US6517992B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An N-sulfonyloxyimide compound having the formula (1): wherein X represents a single bond or a double bond, Y and Z represent a hydrogen atom or others and may combine to form a cyclic structure; and R is a group having the formula (2): wherein X1 represents an organic group having an ester linkage, R1 represents an alkyl group or an alkoxyl group; and m is an integer of 1 to 11 and n is an integer of 0 to 10, satisfying m+n≦11; and chemically amplified positive and negative radiation-sensitive resin compositions using the compound are provided. The N-sulfonyloxyimide compound is a good radiation-sensitive acid-generating agent, has no problem of volatilization or side reaction, can keep dark reaction from taking place during the storage. The compound is useful as a component of radiation-sensitive chemically amplified resists.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.