Method of removing photoresist film
US6517999B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 12, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jul 12, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/428
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of removing photoresist film with high efficiency of removal and friendliness with the environment while reducing the material consumption and the cost for the ventilation facility, and an apparatus used for the method are provided. Particularly the present invention provides a method of removing a photoresist film provided on a surface of a substrate, comprising steps of in a sealed system, disposing the substrate surface having the photoresist film to contact with a photoresist film removing solution, making ozone exist in gas phase and/or solution phase in the vicinity of the liquid surface of the photoresist film removing solution, and changing a relative position between the surface of the substrate and the liquid surface of the solution to decompose or remove the photoresist film from the substarate, characterized in that the relative position is changed continuously or intermittently within a range between a position where a bottom edge of the substrate is present above the liquid surface of the solution, and another position where a top edge of the substrate is present below the liquid surface of the solution. The present invention also provides an apparatus used f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.