Method of producing a micromechanical structure for a micro-electromechanical element

US6518084B1 · kind B1 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Stefan Seitz · Windach, DE
• Leonhard Hoefter · Munich, DE
• Juergen Kruckow · Munich, DE
• Karl Neumeier · Taufkirchen, DE
• Dieter Bollmann · Munich, DE

Key dates

• Filing date: Sep 12, 2001
• Grant date: Feb 11, 2003
• Expiry date: Sep 12, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0728
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In a method of producing a micromechanical structure for a micro-electromechanical element, a first intermediate layer, which is applied to a first main surface of a first semiconductor wafer, is structured in a first step so as to produce a recess. The first semiconductor wafer is then connected via the first intermediate layer to a second semiconductor wafer in such a way that a hermetically sealed cavity is defined by the recess. Finally, one of the wafers is thinned from a surface facing away from said first intermediate layer so as to produce a diaphragm-like structure on top of the cavity. At least one further intermediate layer is provided between the two semiconductor wavers which, prior to the connection of the two semiconductor wafers, is structured in such a way that the structure formed in said at least one further intermediate layer and the recess in said first intermediate layer define the cavity.