Polymer stud grid array

US6518088B1 · kind B1 · utility

Assignee

• Siemens N.V. and Interuniversitair Micro-Electronica Centrum VZW · BE

Inventors

• Marcel Heerman · Merelbeke, BE
• Joost Wille · Loppem, BE
• Jozef Puymbroeck Van · Beernem, BE
• Jean Roggen · Lummen, BE
• Eric Beyne · Heverlee, BE
• Rita Hoof Van · Boortmeerbeek, BE

Key dates

• Filing date: Oct 2, 2000
• Grant date: Feb 11, 2003
• Expiry date: Oct 2, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09118
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.