Semiconductor device and manufacturing method thereof
US6518090B2 · kind B2 · utility
19Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a circuit board on which a semiconductor chip is mounted via an adhesive resin layer and through which a moisture drain hole is formed. A pit part having a width wider than a diameter of the moisture drain hole is formed in a part of the adhesive resin layer exposed in the moisture drain hole. On this account, the semiconductor device can properly drain moisture to the outside when the semiconductor device is mounted on another packaging substrate by reflowing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.