Self-assembled monolayer directed patterning of surfaces
US6518168B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 2, 1998 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Nov 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A technique for creating patterns of material deposited on a surface involves forming a self-assembled monolayer in a pattern on the surface and depositing, via chemical vapor deposition or via sol-gel processing, a material on the surface in a pattern complementary to the self-assembled monolayer pattern. The material can be a metal, metal oxide, or the like. The surface can be contoured, including trenches or holes, the trenches or holes remaining free of self-assembled monolayer while the remainder of the surface is coated. When exposed to deposition conditions, metal or metal oxide is deposited in the trenches or holes, and remaining portions of the article surface remain free of deposition. The technique finds particular use in creation of conductive metal pathways selectively within holes passing from one side of a substrate to another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.