Substrate processing system

US6518193B1 · kind B1 · utility

Assignee

• LSI Logic Corporation · US

Inventors

• Kiran Kumar · Kanchinakote, IN
• Zhihai Wang · Sunnyvale, US
• Rudy Rios · San Jose, US
• Wilbur G. Catabay · Saratoga, US
• Richard Schinella · Saratoga, US

Key dates

• Filing date: Mar 9, 2001
• Grant date: Feb 11, 2003
• Expiry date: Mar 9, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76843
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus for performing contaminant sensitive processing on a substrate. A substrate load chamber receives the substrate from an ambient contaminant laden environment, and isolates the substrate from the ambient contaminant laden environment. The substrate load chamber further forms a first environment of intermediate cleanliness around the substrate. A substrate pass through chamber receives the substrate from the substrate load chamber, and isolates the substrate from the intermediate cleanliness of the first environment of the substrate load chamber. The substrate pass through chamber further forms a second environment of high cleanliness around the substrate. A substrate transfer chamber receives the substrate from the substrate pass through chamber, and isolates the substrate from the high cleanliness of the second environment of the substrate pass through chamber. The substrate transfer chamber maintains a third environment of high cleanliness around the substrate, and transfers the substrate into more than one substrate processing chambers, where the substrate is selectively transferred into and out of the more than one substrate processing chambers without leaving the h…