Electronic part and method of assembling the same
US6518501B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Oct 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the top face of the resin base, a bonding wire for connecting a lead portion on the top face of the resin base and the electronic device, and a resin cap which is bonded on the resin base so as to form a space between the resin cap and the resin base. Apart of the lead is bent along the surface of the plastic package. It is also possible to dispose the surface acoustic wave device so that its electrode pattern formation surface faces the resin base without using the bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.