Ceramic multilayer circuit boards mounted on a patterned metal support substrate
US6518502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | May 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.